Precision Wafer Grinding

THAT provides high-volume precision semiconductor wafer grinding at its state-of-the-art processing center. THAT grinds wafers to submicron TTVs, which is a prerequisite to the tight tolerances required for bonded wafer, dielectric isolation, MEMS, optical devices, and other precision technologies. When quality and tight tolerances are a must, turn to THAT Corporation for timely, expert service.

For additional information see our Wafer Grinding Datasheet

For a quote or technical support please contact Mr. Carol Turgeon, Production Engineer, at the address below:

E mail: grinding@thatcorp.com

Telephone: +1 (508) 478-9200 ext. 134

Equipment:
  Strasbaugh 7AF precision grinder
  Temp controlled spindle, temp controlled process water.
  MTI 200SA wafer thickness measurement system
  RCA1 cleaning capabilities
  HEPA laminar flow hoods
  Nomarski Microscope

Facilities:
  670 sq ft white room grinding center
  675 sq ft Class 10000 clean room for RCA1 cleaning (Class 100 under hoods)
  DI water system
  Ambient temperature and humidity control