THAT Semiconductor Wafer Grinding


	Semiconductor Foundry	Equipment List	Precision Wafer Grinding	Contact Information


	Precision Semiconductor Wafer Grinding
	THAT performs high-volume precision semiconductor wafer grinding at its state-of-the-art processing center. THAT grinds wafers to submicron TTVs, which is a prerequisite to the tight tolerances required for bonded wafer, dielectric isolation, MEMS, optical devices, and other precision technologies.
		Equipment: Strasbaugh 7AF precision grinder Temp controlled spindle, temp controlled process water MTI 200SA wafer thickness measurement system RCA1 cleaning capabilities HEPA laminar flow hoods Nomarski Microscope Facilities: 670 sq ft white room grinding center 675 sq ft Class 10000 clean room for RCA1 cleaning (Class 100 under hoods) DI water system Ambient temperature and humidity control