Semiconductor Fab Equipment List

The following is a brief summary of our fab capabilities:

  — Wafer size: 100 mm (4 inch wafers)

  — Clean room specification: Class 1000 (Class 100 under laminar hoods)

Selected fab equipment:

  — Perkin-Elmer projection aligners (capable of 3 micron feature size)

  — MRC sputtering machine with 3 target capability (SiCr, NiCr, Al)

  — Fully automated Thermco diffusion furnaces with SiC cantilever loading

  — Wet and dry etching capability

  — KOH-based Anisotropic etch bath for V-groove etching

Contact us now to begin discussing your foundry requirements.