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Semiconductor Foundry ![]() |
Equipment List ![]() |
Contact Information ![]() |
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Semiconductor Fab Equipment List |
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— Wafer size: 100 mm (4 inch wafers) — Clean room specification: Class 1000 (Class 100 under laminar hoods) Selected fab equipment: — Perkin-Elmer projection aligners (capable of 3 micron feature size) — MRC sputtering machine with 3 target capability (SiCr, NiCr, Al) — Fully automated Thermco diffusion furnaces with SiC cantilever loading — Wet and dry etching capability — KOH-based Anisotropic etch bath for V-groove etching
Contact us now to begin discussing your foundry requirements. |
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